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Research Topics
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Signal Integrity
Development of model construction, analysis methodology, compensation technique, or even practical layout improvement for high-speed packaging systems.
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Microwave & Millimeter Wave Components
Development of high performance and miniaturized passive components for system-on-package (SoP) applications at microwave and millimeter wave frequencies.
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Computational Electromagnetics
Development of numerical programs for the analysis of electromagnetic problems along with the improvement of present computational methods.
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Trainning courses
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Tutorial
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